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Revolutionizing Power Electronics: 100V MOSFETs for Superior Thermal Efficiency
In high-performance power electronics, the push for higher power density and switching speed continues to intensify. As a result, thermal management is no longer just a design consideration but a key performance enabler. MCC’s new MCTT1D7N10Y and MCTT1D9N10YH, housed in a TO-Leaded Topside Cooling (TOLT) package, deliver excellent thermal performance, high current capability, and robust reliability for demanding industrial and server applications.
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What Is Topside Cooling and Why It Matters Topside cooling is a thermal management technique where heat is dissipated through the top surface of the MOSFET package. Unlike traditional bottom-cooled designs, the TOLT package exposes the drain pad on top, allowing direct contact with a heatsink, cold plate, or thermal interface material (TIM). This creates a shorter, more efficient thermal path from the junction to the cooling solution. |
How It Works
- Heat flows upward from the MOSFET junction through the top metal plate.
- The exposed surface interfaces directly with external cooling hardware.
- This bypasses the PCB, which typically has higher thermal resistance.
Why Topside Cooling Is a Game-Changer
By removing the PCB from the heat dissipation path, topside cooling:
- Reduces junction temperatures, improving electrical performance.
- Enables higher current handling without thermal derating.
- Simplifies PCB layout, freeing up space for signal routing and component placement.
- Extends system lifespan by lowering thermal stress on surrounding components.
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Features & Benefits:
- 100 V MOSFET family with RDS(on) (max) from 1.7 mΩ to 1.9 mΩ
- Topside cooling TOLT package with exposed drain pad on top
- Direct die-to-heatsink path bypassing PCB for better thermal dissipation
- Low RthJC of 0.36 K/W for efficient heat dissipation
- Low-profile package suitable for space-limited designs
- Good thermal cycling robustness for industrial and harsh-use conditions
- High-current capability with reduced need for derating at higher ambient temperatures
- Optimized for higher switching frequency
The Advantages of TOLT Technology
- Switching frequency determined by device design (gate charge, capacitance Rds(on))
- Superior ruggedness under thermal cycling
- Low-profile design for space-constrained systems
- Enhanced power density without added complexity
Cooler, Stronger, More Reliable
Heat is always the dreaded, silent killer in power electronics. MCC’s MCTT1D7N10Y in the TOLT package turns that challenge into an advantage. With topside cooling, low RDS(on), and high current capability, this MOSFET empowers you to build compact, cooler-running, and power-dense systems that last.
Applications
The MCTT1D7N10Y in TOLT is optimized for high-efficiency, high-current environments:
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Industrial Motor Drives |
Server & Telecom Power Systems |
Power Tools |
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Product Attributes, Parametric & Datasheet
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Product |
Type |
FET Type |
Package |
Drain-Source |
Gate-Source |
Current - Continuous Drain (Id) @ 25°C |
RDS(on) Max @VGS=10V (Ω) |
Datasheet |
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Power MOSFET |
N-Channel |
TOLT |
100V |
±20 |
330A |
0.0017 |
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Power MOSFET |
N-Channel |
TOLT |
100V |
±20 |
272A |
0.0019 |
Now available, purchase directly from MCC or through our authorized distributors.
Unlock superior performance and simplified thermal design with MCC’s innovative topside cooling technology. Contact MCC to request a sample or ask a question.
Looking for insights on dual-side cooling? Prevent overheating and enhance reliability, longevity, and safety with advanced thermal strategies. Get our Thermal Management Guide: A Deeper Dive into MOSFET Cooling.
