3.0 mΩ RDS(on), 40 A Capability in a Compact DFN5060 Package with Trench LV Efficiency

MCC introduces the MCAC3D0P03L, a 30 V P-Channel MOSFET designed to address the challenges of high-side switching in compact, high-efficiency power systems. Leveraging advanced Trench LV technology, this device achieves a low RDS(on) of just 3.0 mΩ (max at VGS = -10 V), minimizing conduction and switching losses to maintain high efficiency under demanding load conditions. 

The space-saving DFN5060 package features an exposed thermal pad and a low junction-to-case thermal resistance (RθJC = 0.82°C/W), enabling effective heat transfer to the PCB and supporting stable high-current operation with proper layout and thermal design. 

As a true high-side P-Channel MOSFET, the MCAC3D0P03L can eliminate the need for a dedicated high-side driver, simplifying load switches, OR-ing circuits, and hot-swap designs while conserving board space. Its 30 V drain-source rating provides ample margin for 12 V rails and transient events commonly found in server, storage, networking, BMS, and industrial systems. 

Optimized gate charge and capacitance support fast, clean switching with reduced EMI and simplified driver requirements. With robust electrical and thermal ratings, tape-and-reel packaging, and a compact footprint, this device is ready for integration into space-constrained, high-performance power designs. 

Features & Benefits:
  • 30 V P-Channel MOSFET optimized for high-side switching
  • Low RDS(on): 3.0 mΩ max at VGS = -10 V for reduced conduction losses
  • Supports continuous current up to 40 A (dependent on thermal design)
  • Trench LV technology for lower switching losses and improved efficiency
  • RθJC = 0.82°C/W for efficient heat dissipation
  • Compact DFN5060 package with exposed pad for high power density
  • Suitable for 12 V rails with 30 V VDS rating for transient protection
  • Fast switching performance with reduced EMI and simplified driver sizing

Product Highlights   

30V 3mΩ P-CHANNEL MOSFET

1

High Efficiency
Achieves a low RDS(on) of 3.0 mΩ at VGS = -10 V using Trench LV technology, minimizing conduction and switching losses to maintain high system efficiency under heavy load conditions.

30V 3mΩ P-CHANNEL MOSFET

2

Thermal Headroom
Features a low junction-to-case thermal resistance (RθJC = 0.82°C/W) and an exposed-pad DFN5060 package, enabling effective heat transfer to the PCB and supporting stable high-current operation with proper copper layout and vias. 

30V 3mΩ P-CHANNEL MOSFET

3

Simplified High-Side Design

P-Channel topology allows direct high-side control without the need for a separate high-side driver, reducing bill of materials, design complexity, and development time for load switches, OR-ing circuits, and hot-swap paths. 

30V 3mΩ P-CHANNEL MOSFET

4

Compact Power Density
The DFN5060 footprint delivers high current capability in space-constrained designs, helping conserve board area while maintaining performance across server, storage, networking, PMU, BMS, and DC-DC applications. 

 

Applications

telecommunication applications - mcc semi - micro commercial 500x300 Energy storage systems  - battery - mcc semi - micro commercial components 500x300 smart home devices mcc semi micro commercial components 500x300 electric motors - mcc semi micro commercial components 500x300

Enterprise & Data Infrastructure 

Energy & Battery Systems 

Consumer & Embedded Electronics 

Industrial & Automation 

  • Power distribution and load switching in servers, storage systems, and networking equipment 
  • OR-ing and hot-swap paths in PSUs and rack systems 
  • Power rail gating in VRMs and backplane control 
  • Battery Management Systems (BMS) for pack/load switching 
  • UPS and portable power station high-side control 
  • Solar microinverter DC bus management 
  • Power Management Units (PMUs) in compact devices 
  • High-side switching for SBCs, smart home hubs, and NAS systems 
  • Rail selection in DC-DC converters for home appliances 
  • Motor drive high-side supply switching 
  • Power rail control in PLCs and industrial PCs 
  • Protection and OR-ing in redundant DC supplies 
 

 

Product Attributes, Parametrics & Datasheet

Product

Type

Package

 Drain-Source 
Voltage 
VDS (V) 

Gate-Source 
Voltage 
VGS (V

Drain-Source 
On-Resistance 
RDS(ON) 
Max 
@VGS=10V (Ω )

Mounting Type   

Datasheet

MCAC3D0P03L

P-Channel Power MOSFET 

DFN5060 

-30

±20

0.003

Surface mount 

Info

 

Now available, purchase directly from MCC or through our authorized distributors.   

Use the MCC chatbot to quickly request a sample or ask a question.  

 

MCC
Post by MCC
November 3, 2025
MCC is a leading integrated device manufacturer (IDM) of discrete semiconductors worldwide. Headquartered in the US, we deliver supply chain assurance, best-in-class support, and a diverse portfolio of 10,000+ advanced components to help customers innovate in automotive, industrial, and beyond.