Maximizing Thermal Performance in Product Design: Key Considerations

The MCC team was thrilled to be a part of Future Advanced Engineering University in Spain April 24-28, 2023.

The event was a great opportunity to discuss modern design challenges with engineers, FAEs, and electronics experts in the EMEA.

Bruno Duranton, Field Application Engineer Manager, EMEA, gave an informative presentation, Maximizing Thermal Performance in Product Design: Key Considerations.

The in-depth training covered the following topics:  

• Design considerations
• Heat transfer mechanisms
• Heat sink effects and analysis
• Parameter transformation
• Thermal modeling
• Understanding the thermal resistance curve
• Thermal materials
• SPICE modeling
• PCB thermal layout

 

He enjoyed meeting with so many industry professionals to share his knowledge on how to improve thermal performance of product designs, even amid ever-changing trends and market demands.

Participating in industry events is essential to help us meet with customers, discuss how some of our exciting NPIs can solve pressing design issues, and share knowledge with experts from around the globe.

We look forward to the next Future training event. Until then, contact us through the MCC website chatbot to learn how we can help you elevate your next product design. 

I’d like to thank everyone who made this event a huge success! At MCC, we look forward to advancing electronics and engineering with Future for many years to come." — Bruno Duranton, Field Application Engineer Manager, EMEA