In industrial electronics, MOSFET package selection is critical for optimizing performance, efficiency, and space constraints. The appropriate package can significantly influence various operational parameters, including:
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Choosing between different packages goes beyond physical dimensions to consider how certain aspects impact circuit design and functionality. As electronic devices become more compact while power demands increase, engineers must prioritize packages that maximize efficiency while adhering to shrinking space requirements.
Making the appropriate decision requires a thorough understanding of each package type’s features and benefits, such as the differences between TOLL and D2PAK.
The TOLL package is a compact and contemporary surface-mounted device (SMD) designed for high power density. It is specifically engineered to accommodate the increasing demands for smaller, more efficient electronic components. These features are especially beneficial in applications that require substantial current handling capabilities while maintaining a minimal footprint.
One notable feature of the TOLL is its size compared to other MOSFET packages. Its design footprint is typically up to 30% smaller than the popular D2PAK package.
This reduction facilitates enhanced design flexibility and better integration into systems where size constraints are critical.
Optimizing thermal performance, the TOLL also boasts a 50% smaller package height, which improves heat dissipation capabilities.
Compared to the D2PAK package, the TOLL’s advantages can be substantial in overall performance, especially for industrial applications.
| Performance Aspect | TOLL Package |
|---|---|
| High Power Density | Capability to handle substantial currents in a compact form factor offers significant advantages for high-power applications. |
| Cost Efficiency | Minimizing component size and reducing the need for parallel MOSFETs contributes to lower manufacturing costs and improved profit margins. |
| Size Optimization | Reduced dimensions alleviate design constraints associated with limited space, enabling engineers to develop more efficient systems. |
| Enhanced EMI Performance | The design of the TOLL package effectively mitigates EMI occurrences, which is crucial for maintaining operational integrity in industrial settings. |
| Improved Reliability | The minimized parasitic inductance inherent in the TOLL package ensures stable operation and high reliability — critical factors in industrial applications where failure can have severe repercussions. |
| Thermal Performance | The junction-to-case thermal resistance is significantly lower than typical packages like DFN and D2PAK, delivering a typical reduction in thermal resistance of 60%. |
Designed with compact size and high power density, TOLL components are well-suited for a variety of demanding applications, including:
The TOLL package provides substantial advantages in terms of size, efficiency, and performance — qualities that are increasingly valuable in high-power electronic environments.
To satisfy market demands, MCC’s extensive power MOSFET portfolio features TOLL packages in voltages ranging from 40V to 600V, which are optimal for modern electronics.
Some of our most popular MOSFETs featuring the advanced TOLL package include:
| Part Number | Package Type | Drain-Source Voltage VDS | Datasheet |
|---|---|---|---|
| MCTL270N04YHE3 | TOLL-8L | 40V | Info |
| MCTL150N06YHE3 | TOLL-8L | 60V | Info |
| MCTL2D1N10YH | TOLL-8L | 100V | Info |
| MCTL2D0N10YHR | TOLL-8L | 100V | Info |
For engineers seeking to optimize their designs, the TOLL package could be an ideal solution. Our team of experts is here to help recommend the right component for the application requirements.
To learn more about MCC’s solutions for medium-voltage applications, check out our essential guide to 40V MOSFETs.