Sharing the Advantages of Efficient Thermal Management

At MCC, educating engineers on news and technologies to help improve their designs is a priority. We’re proud to share that the MCC team authored an article for everything PE’s first issue of 2025. “How Dual-Side Cooling Technology Drives Efficient Thermal Management” highlights the importance of optimal thermal performance, plus how our innovative dual-side cooling (DSC) MOSFET technology is engineered to enhance efficiency and performance from top to bottom. 

Key topics include:

• Our DSC package’s unique design, including a double-sided cooling pad and copper clip technology
• Thermal-enhancing technical features, such as an impressive low junction-to-case thermal resistance and minimal temperature rise
• The many performance-boosting advantages the DSC package delivers — from extended lifespan to high power density
• A comparison of the traditional DFN5060 MOSFET package and the DFN5060 with DSC

For a deeper dive into how DSC technology can enhance your designs, read the full article in everything PE, or check out our dual-side cooling MOSFET guide.

The industry-leading magazine also recently interviewed TH Koay, Product Marketing Director, and Roberto Pérez Islas, FAE Manager, for a feature article, where the team discussed MCC’s components and their benefits, as well as our new production facility in Vietnam.