---
title: MCC Presents at Future Advanced Engineering University
description: MCC recently attended Future Advanced Engineering University, where Bruno Duranton, FAE Manager, shared insights on thermal modeling and product design.
image: https://solutions.mccsemi.com/hubfs/MCC%20Presents%20at%20Future%20Advances%20Engineering%20University%20%20%281%29.jpg
---
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# MCC Presents at Future Advanced Engineering University
# MCC Presents at Future Advanced Engineering University
.png?width=50&height=50&name=mcc%20150x150%20(1).png)
by [MCC](https://solutions.mccsemi.com/news/author/mcc)
May 18, 2023
## **Maximizing Thermal Performance in Product Design: Key Considerations**
The MCC team was thrilled to be a part of [Future Advanced Engineering University in Spain April 24-28, 2023](https://solutions.mccsemi.com/future-advances-engineering-university-emea-april-2023).
The event was a great opportunity to discuss modern design challenges with engineers, FAEs, and electronics experts in the EMEA.
Bruno Duranton, Field Application Engineer Manager, EMEA, gave an informative presentation, **Maximizing Thermal Performance in Product Design: Key Considerations.**
The in-depth training covered the following topics:
- Design considerations
- Heat transfer mechanisms
- Heat sink effects and analysis
- Parameter transformation
- Thermal modeling
- Understanding the thermal resistance curve
- Thermal materials
- SPICE modeling
- PCB thermal layout
| .jpg?width=500&height=300&name=MCC%20Presents%20at%20Future%20Advances%20Engineering%20University%20(6).jpg) | .jpg?width=500&height=300&name=MCC%20Presents%20at%20Future%20Advances%20Engineering%20University%20(2).jpg) | .jpg?width=500&height=300&name=MCC%20Presents%20at%20Future%20Advances%20Engineering%20University%20(3).jpg) |
| --- | --- | --- |
|  | .jpg?width=500&height=300&name=MCC%20Presents%20at%20Future%20Advances%20Engineering%20University%20(5).jpg) | .jpg?width=500&height=300&name=MCC%20Presents%20at%20Future%20Advances%20Engineering%20University%20(4).jpg) |
He enjoyed meeting with so many industry professionals to share his knowledge on how to improve thermal performance of product designs, even amid ever-changing trends and market demands.
Participating in industry events is essential to help us meet with customers, discuss how some of our exciting NPIs can solve pressing design issues, and share knowledge with experts from around the globe.
We look forward to the next Future training event. Until then, contact us through the [MCC](https://solutions.mccsemi.com/news/mcc-presents-at-future-advanced-engineering-university#hs-chat-open)[website chatbot](https://solutions.mccsemi.com/news/mcc-presents-at-future-advanced-engineering-university#hs-chat-open)to learn how we can help you elevate your next product design.
|  | > I’d like to thank everyone who made this event a huge success! At MCC, we look forward to advancing electronics and engineering with Future for many years to come." > > — *Bruno Duranton, Field Application Engineer Manager, EMEA* |
| --- | --- |
###### Tags:
[Events,](https://solutions.mccsemi.com/news/tag/events) [News](https://solutions.mccsemi.com/news/tag/news)
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.png?width=50&height=50&name=mcc%20150x150%20(1).png)
Post by [MCC](https://solutions.mccsemi.com/news/author/mcc)
May 18, 2023
MCC is a leading integrated device manufacturer (IDM) of discrete semiconductors worldwide. Headquartered in the US, we deliver supply chain assurance, best-in-class support, and a diverse portfolio of 10,000+ advanced components to help customers innovate in automotive, industrial, and beyond.
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