MCC’s DFN5060 MOSFET package with dual-side cooling (DSC) is a game-changer for power electronics. This advanced power MOSFET technology offers exceptional thermal performance due to its optimized package architecture, which incorporates a Split-Gate Trench design and a copper clip for enhanced heat dissipation. These features significantly reduce thermal resistance and improve efficiency, making it a superior choice for demanding applications.
The DFN5060 with double-sided cooling represents a major advancement in MOSFET design, delivering superior performance over traditional packages. This innovative solution effectively reduces thermal resistance and enhances heat dissipation, which are crucial for maintaining reliability in power-demanding applications.
The DFN5060 package with dual-side cooling (DSC) features thermal pads on the top and bottom with an additional transfer path on the top for junction-to-case thermal resistance a low as 0.67⁰C/W. This feature offers a better temperature rise margin than traditional DFN5060 packages.
Our DSC MOSFET solutions are well-suited for a diverse range of demanding applications where thermal management and reliability are essential.
Highlights: MCACLS290N04YHE3
Highlights: MCACLS330N04YAHE3
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