Dual Side Cooling Technology in DFN 5x6 Packages:

Next-generation Thermal Management Solutions

Engineered for Optimal Thermal Performance

MCC’s DFN5060 MOSFET package with dual-side cooling (DSC) is a game-changer for power electronics. This advanced power MOSFET technology offers exceptional thermal performance due to its optimized package architecture, which incorporates a Split-Gate Trench design and a copper clip for enhanced heat dissipation. These features significantly reduce thermal resistance and improve efficiency, making it a superior choice for demanding applications.

Key Features for Efficiency and Longevity

The DFN5060 with double-sided cooling represents a major advancement in MOSFET design, delivering superior performance over traditional packages. This innovative solution effectively reduces thermal resistance and enhances heat dissipation, which are crucial for maintaining reliability in power-demanding applications.

Features

  • Innovative Copper Clip Technology: Improves thermal conductivity for better heat transfer.
  • Split-Gate Trench Design: Facilitates efficient heat dissipation from both top and bottom surfaces.
  • Low Junction-to-Case Thermal Resistance: Ensures efficient heat transfer.
  • Minimal Temperature Rise: Maintains reliable performance during operation.
  • Dual-Sided Cooling Pad: Enhances heat dissipation from both surfaces.
  • Significant Improvement: Delivers up to a 52% improvement in steady-state thermal resistance compared to conventional MOSFETs.

Benefits:

  • Maximized Thermal Efficiency: Ensures optimal performance.
  • Extended Device Lifespan: Achieved through effective heat management.
  • Higher Power Densities: Supports greater output capabilities.
  • Compact and Reliable Systems: Contributes to smaller, more dependable electronic designs.
  • Versatile Applications: Features scalable thermal management for various uses.
  • Superior Heatsink Efficiency: Enhances overall cooling performance.

Enhanced Thermal Performance

The DFN5060 package with dual-side cooling (DSC) features thermal pads on the top and bottom with an additional transfer path on the top for junction-to-case thermal resistance a low as 0.67⁰C/W. This feature offers a better temperature rise margin than traditional DFN5060 packages.

High-Performance from Top to Bottom

Applications

Our DSC MOSFET solutions are well-suited for a diverse range of demanding applications where thermal management and reliability are essential.

Automotive

  • Battery management systems (BMS)
  • Electric power steering (EPS)
  • Seat controls
  • Lighting controls
  • Electric water pumps
  • Motor drives
  • DC-DC converters

Industrial

  • Battery management systems (BMS)
  • Motor drives

Consumer

  • Power tools
  • Garden tools

Recommended Dual-Side Cooling Power MOSFETs

Auto-Grade MOSFETs

Highlights: MCACLS290N04YHE3

  • Drain-source voltage: 40V
  • Low RDS(on): 1.1 mΩ
  • Continuous drain current: 290A
  • AEC-Q101 qualified
  • Split-gate trench (SGT) technology
  • Superior overall thermal performance compared to DFN5060 package
  • Exceptional top heatsink efficiency
  • High power density package
  • High junction temperature up to 175℃
  • Compact package DFN5060-DSC package (5mm x 6mm)

Power MOSFETS

Highlights: MCACLS330N04YAHE3

  • Drain-source voltage: 40V
  • Low RDS(on): 1.1 mΩ
  • Continuous drain current: 330A
  • AEC-Q101 qualified
  • Split-gate trench (SGT) technology
  • Superior overall thermal performance compared to DFN5060 package
  • Exceptional top heatsink efficiency
  • High power density package
  • High junction temperature up to 175℃
  • Compact package DFN5060-DSC package (5mm x 6mm)
Dual Side Cooling Technology in DFN 5x6 Packages Next-generation thermal management solutions - mcc semi 500x500 - micro commercial components (500 x 500 px)
Dual-side cooling package technology is one of many diverse solutions MCC offers in our comprehensive MOSFET portfolio. Use our essential MOSFET guide to learn when to select each type for ideal performance of your designs.

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