Dual Side Cooling Technology in DFN 5x6 Packages:

Next-generation Thermal Management Solutions

Engineered for Optimal Thermal Performance

MCC’s DFN5060 MOSFET package with dual-side cooling (DSC) is a game-changer for power electronics. This advanced power MOSFET technology offers exceptional thermal performance due to its optimized package architecture, which incorporates a Split-Gate Trench design and a copper clip for enhanced heat dissipation. These features significantly reduce thermal resistance and improve efficiency, making it a superior choice for demanding applications.

Browse MCC’s Power MOSFETs

Key Features for Efficiency and Longevity

The DFN5060 with double-sided cooling represents a major advancement in MOSFET design, delivering superior performance over traditional packages. This innovative solution effectively reduces thermal resistance and enhances heat dissipation, which are crucial for maintaining reliability in power-demanding applications.

Features

  • Innovative Copper Clip Technology: Improves thermal conductivity for better heat transfer.
  • Split-Gate Trench Design: Facilitates efficient heat dissipation from both top and bottom surfaces.
  • Low Junction-to-Case Thermal Resistance: Ensures efficient heat transfer.
  • Minimal Temperature Rise: Maintains reliable performance during operation.
  • Dual-Sided Cooling Pad: Enhances heat dissipation from both surfaces.
  • Significant Improvement: Delivers up to a 52% improvement in steady-state thermal resistance compared to conventional MOSFETs.

Benefits:

  • Maximized Thermal Efficiency: Ensures optimal performance.
  • Extended Device Lifespan: Achieved through effective heat management.
  • Higher Power Densities: Supports greater output capabilities.
  • Compact and Reliable Systems: Contributes to smaller, more dependable electronic designs.
  • Versatile Applications: Features scalable thermal management for various uses.
  • Superior Heatsink Efficiency: Enhances overall cooling performance.

Enhanced Thermal Performance

The DFN5060 package with dual-side cooling (DSC) features thermal pads on the top and bottom with an additional transfer path on the top for junction-to-case thermal resistance a low as 0.67⁰C/W. This feature offers a better temperature rise margin than traditional DFN5060 packages.

High-Performance from Top to Bottom

Applications

Our DSC MOSFET solutions are well-suited for a diverse range of demanding applications where thermal management and reliability are essential.

Automotive

  • Battery management systems (BMS)
  • Electric power steering (EPS)
  • Seat controls
  • Lighting controls
  • Electric water pumps
  • Motor drives
  • DC-DC converters

Industrial

  • Battery management systems (BMS)
  • Motor drives

Consumer

  • Power tools
  • Garden tools

Recommended Dual-Side Cooling Power MOSFETs

Auto-Grade MOSFETs

Highlights: MCACLS290N04YHE3

  • Drain-source voltage: 40V
  • Low RDS(on): 1.1 mΩ
  • Continuous drain current: 290A
  • AEC-Q101 qualified
  • Split-gate trench (SGT) technology
  • Superior overall thermal performance compared to DFN5060 package
  • Exceptional top heatsink efficiency
  • High power density package
  • High junction temperature up to 175℃
  • Compact package DFN5060-DSC package (5mm x 6mm)
Read more

Power MOSFETS

Highlights: MCACLS330N04YAHE3

  • Drain-source voltage: 40V
  • Low RDS(on): 1.1 mΩ
  • Continuous drain current: 330A
  • AEC-Q101 qualified
  • Split-gate trench (SGT) technology
  • Superior overall thermal performance compared to DFN5060 package
  • Exceptional top heatsink efficiency
  • High power density package
  • High junction temperature up to 175℃
  • Compact package DFN5060-DSC package (5mm x 6mm)
Read more
Dual Side Cooling Technology in DFN 5x6 Packages Next-generation thermal management solutions - mcc semi 500x500 - micro commercial components (500 x 500 px)

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